Mid-cycle — watch for announcements before buying
Best for: Professional makers, small studios, and engineers who need dual-material printing — particularly for PVA soluble supports, dual-color engineering parts, or high-throughput production.
Full details →Overdue for a refresh — no successor announced yet. Prices should be at their lowest
Best for: Makers and small businesses who need a large enclosed build volume for engineering materials at a prosumer price — particularly those printing PA-CF, ABS, and PC at scale.
Full details →| Bambu Lab H2S | Qidi Tech Plus4 | |
|---|---|---|
| Tier | Professional | Prosumer |
| Motion | CoreXY | CoreXY |
| Build Volume | 350 × 320 × 325 mm | 305 × 305 × 280 mm |
| Max Speed | 600 mm/s | 600 mm/s |
| Multicolor | ✅ 2 slots | ✅ 4 slots |
| Enclosure | ✅ | ✅ |
| Auto Calibration | ✅ | ✅ |
| Open Source | ❌ | ❌ |
| Upgrade Kit | — | — |
| Materials | PLA, PETG, ABS, ASA, TPU, PA, PA-CF, PC, PETG-CF | PLA, PETG, ABS, ASA, TPU, PA, PA-CF, PC, PPS-CF |
| Released | Jun 15, 2025 | Sep 20, 2024 |
| Cycle length | ~270 days | ~408 days |
| Cycle advice | Caution | Wait |
| Deals advice | Caution | Buy |
| Next model | H2C (Expected late 2026) | — |
The H2S adds better high-speed cooling and more consistent layer adhesion at 600 mm/s, addressing key H2D pain points.
Dual-nozzle printing eliminates the purge tower required by filament-switching systems — faster prints, less wasted filament.
Print PLA + PVA or ABS + HIPS combinations for complex geometries that would be impossible with a single material.
One of the largest build volumes in the prosumer enclosed category — 40% more printable area than the Bambu X1C at a lower price point.
The second-generation active heating delivers consistent chamber temperatures for PA, PA-CF, ABS, ASA, and PC with minimal warping across the full build plate.
Handles high-performance engineering composites including PA-CF, PET-CF, and PPS-CF without requiring a separate hotend upgrade.