Overdue for a refresh — no successor announced yet. Prices should be at their lowest
Best for: Professional makers and small studios who need dual-material printing for engineering parts with soluble supports — or true dual-color without purge waste.
Full details →Late in cycle — a new model is likely coming soon
Best for: Serious makers and prosumers who need enclosed printing for ABS, ASA, PA, PA-CF, and PC — and want Bambu's plug-and-play experience at a prosumer price.
Full details →| Bambu Lab H2D | Bambu Lab P2S | |
|---|---|---|
| Tier | Professional | Prosumer |
| Motion | CoreXY | CoreXY |
| Build Volume | 350 × 320 × 325 mm | 256 × 256 × 256 mm |
| Max Speed | 600 mm/s | 500 mm/s |
| Multicolor | ✅ 2 slots | ✅ 4 slots |
| Enclosure | ✅ | ✅ |
| Auto Calibration | ✅ | ✅ |
| Open Source | ❌ | ❌ |
| Upgrade Kit | — | — |
| Materials | PLA, PETG, ABS, ASA, TPU, PA, PA-CF, PC, PETG-CF | PLA, PETG, ABS, ASA, TPU, PA, PA-CF, PC |
| Released | Nov 15, 2024 | Jun 15, 2025 |
| Cycle length | ~210 days | ~270 days |
| Cycle advice | Wait | Wait |
| Deals advice | Buy | Buy |
| Next model | — | P3S or next prosumer model (Expected mid-2026) |
The H2D prints two materials simultaneously from two nozzles. This eliminates purge tower waste and enables true dual-material prints including PVA/PLA soluble support combinations.
350×320×325 mm gives more print area than the standard 256 mm Bambu models — suited for larger professional parts.
The H2D supports a wide range of engineering filaments including PA-CF, PETG-CF, and PC with its enclosed chamber.
The P2S enclosure maintains a more consistent chamber temperature over the P1S, reducing warping on long ABS and PA prints.
PLA through PC — the P2S handles the entire engineering filament spectrum with reliable results.
The P-series CoreXY enclosure design strikes the best balance of price, speed, and material capability in Bambu's lineup.