First-generation product — recently released, still early days
Best for: Professional studios and engineers who need true multi-material production with dedicated nozzles per material — enabling soluble supports, multi-material composites, and high-throughput professional output without purge waste.
Full details →This printer is no longer sold new. It has been replaced by the Bambu Lab H2S.
Best for: Professional makers and small studios who need dual-material printing for engineering parts with soluble supports — or true dual-color without purge waste.
Full details →| Bambu Lab H2C | Bambu Lab H2D | |
|---|---|---|
| Tier | Professional | Professional |
| Motion | CoreXY | CoreXY |
| Build Volume | 330 × 320 × 325 mm | 350 × 320 × 325 mm |
| Max Speed | 1000 mm/s | 600 mm/s |
| Multicolor | ✅ 7 slots | ✅ 2 slots |
| Enclosure | ✅ | ✅ |
| Auto Calibration | ✅ | ✅ |
| Open Source | ❌ | ❌ |
| Upgrade Kit | — | — |
| Materials | PLA, PETG, ABS, ASA, TPU, PA, PA-CF, PC, PETG-CF, PPS | PLA, PETG, ABS, ASA, TPU, PA, PA-CF, PC, PETG-CF |
| Released | Jan 15, 2026 | Nov 15, 2024 |
| Cycle length | — | ~210 days |
| Cycle advice | Buy | Superseded |
| Deals advice | Caution | Clearance |
| Next model | — | — |
The H2C's Vortek system swaps hotends wirelessly — no filament purging, no switching waste. Each material has its own dedicated nozzle, enabling true multi-material production including soluble support combinations.
With up to 6 active hotends and the Vortek architecture, the H2C supports 7 simultaneous material slots — the highest material count in Bambu's lineup.
At $2,399, the H2C is positioned above the H2S as Bambu's flagship professional tool-changer — targeting studios and engineers who outgrow filament-switching AMS multicolor.
The H2D prints two materials simultaneously from two nozzles. This eliminates purge tower waste and enables true dual-material prints including PVA/PLA soluble support combinations.
350×320×325 mm gives more print area than the standard 256 mm Bambu models — suited for larger professional parts.
The H2D supports a wide range of engineering filaments including PA-CF, PETG-CF, and PC with its enclosed chamber.